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以微米级铜粉为导电填料、酚醛树脂为粘接剂制备了导电油墨,并将该油墨以聚酰亚胺薄膜为基底,采用丝网印刷技术制备导电涂层。研究了铜粉添加量对铜酚醛树脂导电油墨的黏度、固含量以及导电涂层的微观形貌、电阻率和附着力的影响。研究表明,当铜粉添加量质量分数为70%时,制备的铜酚醛树脂导电油墨具有良好的性能,该导电油墨经丝网印刷得到的导电铜膜经低温固化后具有良好的电性能,其电阻率最低可以达到53.865×10–3Ω·cm。
Conductive ink was prepared by using micron-grade copper powder as the conductive filler and phenolic resin as the binder. The conductive ink was prepared on the polyimide film by screen printing technique. The effects of copper powder addition on the viscosity and solid content of copper-phenolic resin conductive ink, as well as the morphology, resistivity and adhesion of the conductive coating were studied. The results show that when the mass fraction of copper powder is 70%, the prepared copper phenolic resin conductive ink has good performance. The conductive ink obtained by screen printing has good electrical properties after being cured at low temperature. The lowest resistivity can reach 53.865 × 10-3Ω · cm.