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介绍用于 0 .35μm投影光刻机的逐场调平技术 ,讨论其检测和控制原理 ,并作精度分析 ;讨论逐场调平对套刻精度的影响 ,并建立三轴测量逐场调平的套刻步进模型。
This paper introduces the field-by-field leveling technology used in 0.35μm projection lithography machine, discusses its detection and control principle, and makes the precision analysis. It also discusses the effect of field-by-field leveling on the overlay precision and establishes the field- Set of carved stepper models.