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本文对面积在60×100毫米以下,厚度在1～2毫米的微包组装稳定状态温度场用计算机进行辅助分析。对矩形微包装切割成一层(也可两层)均匀单元网格,网格表面允许装有芯片等发热元件。每单元网格满足能量守恒定律。单元网格细小时,网格温度用格中心点温度代表,并与上下左右六个方向的网格或环境温度有关。类似电路用等效热阻串并联办法列出联立方程组。热阻面积取二单元网格交界面积,距离为两网格中心间距
In this paper, an area of 60 × 100 mm below the thickness of 1 ~ 2 mm assembly temperature stability of the micro-state field with a computer-assisted analysis. Rectangular micro-packaging cut into a layer (also two layers) uniform cell grid, the grid surface allows the chip and other heating elements. Each cell grid satisfies the law of conservation of energy. When the cell grid is small, the grid temperature is represented by the cell center temperature and is related to the grid or ambient temperature in up, down, left and right directions. Similar circuit with equivalent thermal resistance series-parallel method listed in simultaneous equations. Thermal resistance area to take two cell grid interface area, the distance between the two grid center spacing