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采用真空压力浸渍法和热挤压法制备了碳化硼颗粒和碳化硅晶须混杂增强MB15Mg合金复合材料．通过配备能量色散谱仪（EDS）和电子能量损失谱仪（EELS）的分析型电镜研究了这种复合材料的界面微结构.研究结果表明，碳化硼颗粒表面的玻璃态氧化硼和Mg发生界面反应4Mg（1）＋B2O3（1）＝MgB2（s）＋3MgO（S）；液态Mg对碳化朋颗粒发生润湿，加强了界面结合，使复合材料具有优异的力学性能由于高温时氧化硼的可流动性，在碳化硼颗粒附近的碳化硅晶须和基体的界面区域也发生了类似的反应而远离碳化硼颗粒的碳化硅品须和Mg基体成平直界面，界面上有β（MgZn2）相析出.
The boron carbide particles and silicon carbide whiskers mixed enhanced MB15Mg alloy composite were prepared by vacuum pressure impregnation method and hot extrusion method. The interfacial microstructure of the composites was investigated by means of EDS with energy dispersive spectrometer (EDS) and electron energy loss spectroscopy (EELS) .The results show that the interface between the glassy boron oxide and Mg on the surface of boron carbide particles Reaction of 4Mg (1) + B2O3 (1) = MgB2 (s) + 3MgO (S); Liquid Mg wetted the carbide particles and strengthened the interfacial bonding to make the composites have excellent mechanical properties. Due to the flow of boron oxide at high temperature, , A similar reaction takes place in the interface area between the silicon carbide whiskers near the boron carbide particles and the substrate. The silicon carbide whisker far away from the boron carbide particles must be in a flat interface with the Mg substrate, with the precipitation of the β (MgZn2) phase at the interface .