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在半导体硅片(Si)-扩散阻挡层(Ni-Cr合金)-金属互连材料(Cu)构成的体系中,Si和Ni-Cr合金之间以及Ni-Cr合金和Cu之间各构成一对扩散偶.通过制备扩散偶试样模拟相应的界面反应,实验测定950℃下界面反应产物的表观序列.从热力学的角度,分别对Cr-Ni-Si和Cr-Cu-Ni三元系中Si/(Ni-Cr)和(Ni-Cr)/Cu两个界面进行反应驱动力分析.计算获得的阶段性生成相表观序列与实验测得结果一致.
In a system composed of a semiconductor Si wafer, a diffusion barrier layer (Ni-Cr alloy) and a metal interconnection material (Cu), each of the Si and Ni-Cr alloys and the Ni- Pairs of diffusion pairs. The diffusion-bonded samples were simulated for the corresponding interfacial reactions to experimentally determine the apparent sequence of the interfacial reaction products at 950 ° C. From the thermodynamic point of view, the Cr-Ni-Si and Cr-Cu-Ni ternary systems (Ni-Cr) and (Ni-Cr) / Cu at two interfaces were investigated, and the calculated apparent phase sequence of the phase-generated phase was consistent with the experimental results.