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溅射沉积和离子镀是当前最先进的镀膜枝术。一离子镀1963年,D.M.Mattox开发了离子镀技术,它是在蒸镀的基础上发展起来的。蒸镀是在10~(-5)～10~(-6)托的真空容器中用加热的方法使镀膜材料蒸发出原子或分子,飞向工件表面而凝聚成一片薄膜(图1)。如果让蒸发粒子通过由氩气或其它气体辉光放电所形成的等离子气体区域,或由炽热的钨丝放射并经电场加速的电子云区域,则部分蒸发粒子变成离子。用高压直流电场把离子加速。高速离子与中性蒸发粒子相碰
Sputter deposition and ion plating are currently the most advanced plating techniques. An ion plating 1963, D. M. Mattox developed ion plating technology, which is based on the evaporation developed. Evaporation is the vacuum evaporation of 10 ~ (-5) ~ 10 ~ (-6) Torr in the coating material by evaporation of atoms or molecules of the film, fly to the workpiece surface and condensed into a film (Figure 1). The partially evaporated particles become ions if they are passed through a region of plasma gas formed by glow discharge of argon or other gases, or an electron cloud region that is radiated by a hot tungsten filament and accelerated by an electric field. Hypertonic DC field to accelerate ions. High-speed ions collide with neutral evaporating particles