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目的 (Ti,Cu)N薄膜是一种新型的硬质涂层材料,关于其结构和性能的研究报道还较少。研究脉冲偏压对(Ti,Cu)N薄膜结构与性能的影响规律,以丰富该研究领域的成果。方法将多弧离子镀和磁控溅射离子镀相结合构成复合离子镀技术,采用该技术在不同脉冲偏压下于高速钢基体表面制备(Ti,Cu)N薄膜。分析薄膜的微观结构,测定沉积速率及薄膜显微硬度,通过摩擦磨损实验测定薄膜的摩擦系数。结果在不同偏压下获得的(Ti,Cu)N薄膜均呈晶态,具有(200)晶面择优取向,当脉冲偏压为-300 V时,薄膜的择优程度最明显。随着脉冲偏压的增加,薄膜表面大颗粒数量减少且尺寸变小,表面质量提高;沉积速率呈现先增大、后减小的趋势,在脉冲偏压为-400 V时最大,达到25.04 nm/min;薄膜硬度也呈现先增大、后减小的趋势,在脉冲偏压为-300 V时达到最大值1571.4HV。结论脉冲偏压对复合离子镀(Ti,Cu)N薄膜的表面形貌、择优取向、沉积速率和硬度均有影响。
The purpose of (Ti, Cu) N thin film is a new type of hard coating material, and its structure and properties are rarely reported. The influence of pulse bias on the structure and properties of (Ti, Cu) N thin films was studied in order to enrich the achievements in this field. Methods Multi-arc ion plating and magnetron sputtering ion plating were combined to form composite ion plating technology. The (Ti, Cu) N thin films were prepared on the surface of high speed steel with different pulse bias. The microstructure of the film was analyzed. The deposition rate and the microhardness of the film were measured. The friction coefficient of the film was measured by friction and wear test. Results The films of (Ti, Cu) N obtained under different bias voltages were all in the crystalline state with the preferred orientation of (200) crystal plane. The film was most preferred when the pulse bias was -300 V. With the increase of pulse bias, the number of large particles decreases and the size decreases and the surface quality increases. The deposition rate increases first and then decreases, reaching the maximum at a bias voltage of -400 V, reaching 25.04 nm / min. The hardness of the film also increases first and then decreases, reaching a maximum of 1571.4HV at a pulse bias of -300V. Conclusions Pulsed bias has influence on the surface morphology, preferred orientation, deposition rate and hardness of (Ti, Cu) N thin film.