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引言陶瓷与金属的封接是近代电子器件研制的关键工艺之一。近代电子器件的发展对陶瓷-金属封接工艺提出新的要求,而陶瓷-金属封接工艺的发展又进一步推动了电子器件的发展。近代电子器件正向着超高频、大功率、宽
Introduction The sealing of ceramic and metal is one of the key technologies in the development of modern electronic devices. The development of modern electronic devices puts new demands on the ceramic-metal sealing process, and the development of the ceramic-metal sealing process further promotes the development of electronic devices. Modern electronic devices are toward UHF, high power, wide