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7月26日,TTPCom有限公司宣布推出3GDigRF解决方案,它可使半导体器件供应商快速容易地在其3G射频和基带IC中增加一个3GDigRF数字适配接口,从而将DigRF的优势扩展到双模3G芯片组,实现包括更高的集成度、更少的元器件数量、更容易的板级设计和制造、以及射频和基带IC之间的即插即
July 26, TTPCom Ltd. announced the launch of 3GDigRF solution that enables semiconductor device suppliers to quickly and easily add a 3GDigRF digital adapter interface to their 3G radio and baseband IC, extending the benefits of DigRF to dual-mode 3G Chipset, including higher integration, fewer components, easier board design and manufacturing, and plug and play between RF and baseband ICs