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1997年10月31由上海市科委主挂,在上海技术物理研究所召开了“GCH-1型热轧中板半导体激光在线测厚仪”技术鉴定会。与会专家们认真听取了该项目的工作报告、技术报告、测试报告、使用报告和经济效益报告,并观看了该仪器现场使用情况的录象。鉴定委员会认真讨论后一致认为: 1.“GCH-1型热轧中板半导体激光在线测厚仪”通过在轧钢过程中对产品实现在线非接触实时全检,能有效地提高产品合格率,实行负公差轧制、提高放材率、减轻工人的劳动强度。
October 31, 1997 Shanghai Municipal Science and Technology Commission was held in Shanghai Institute of Technical Physics held a “GCH-1 hot-rolled plate semiconductor laser online gage” technical appraisal. Participating experts carefully listened to the project’s work report, technical report, test report, use report and economic benefit report, and watched the video of the scene of the instrument. Accreditation Committee after careful discussion agreed that: 1. “GCH-1-type hot-rolled medium-sized semiconductor laser on-line thickness gauge” through the rolling process in the product online non-contact real-time full inspection, can effectively improve product yield, the implementation of Negative tolerance rolling, increase the release rate, reduce the labor intensity of workers.