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由中国电子学会电子制造与封装技术分会(EMPT)、国际电气电子工程师学会电子元件封装和生产制造技术分会(IEEE-CMPT)、西安电子科技
By the Chinese Institute of Electronics Manufacturing and Packaging Technology Branch (EMPT), Institute of Electronics and Electronic Components Packaging and Manufacturing Technology Branch (IEEE-CMPT), Xi’an Electronics Technology