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前言 特征尺寸不断缩小,每块芯片上的元件数目不断增加,这是硅集成电路(IC)发展的基本趋势。目前商品化VLSI芯片的最小特征尺寸大约为1μm,每块芯片上的元件数大约为100万个。在快到1990年的时候,我们将能看到亚微米特征尺寸和数百万至数千万个元件的芯片出现。随着器件的尺寸及器件之间的间隔缩小到1μm以下,我们需要采用一种新的器件隔离技术,来防止相邻器件之间通过硅衬底出现寄生耦合现象。
Foreword The ever-shrinking feature size and increasing number of components per chip represent a fundamental trend in the development of silicon integrated circuits (ICs). At present, the minimum feature size of commercially available VLSI chips is about 1 μm, and the number of components on each chip is about 1 million. As we approach 1990, we will be able to see submicron feature sizes and chip appearances of millions to tens of millions of components. As device size and device spacing shrink below 1μm, we needed a new device isolation technique to prevent parasitic coupling through the silicon substrate between adjacent devices.