分别在纳米晶铜和粗晶铜表面得到了Ni-P合金镀层,并对两种基体表面镀层的形貌、结合力、耐磨性能进行了分析和比较。结果表明:纳米晶铜表面Ni-P镀层胞状组织较大,沉积速率较快,且纳米晶铜表面Ni-P镀层的结合力和耐磨性都较粗晶铜表面Ni-P镀层的好。 Ni-P alloy coatings were obtained on the surface of nanocrystalline copper and coarse copper respectively. The morphology, adhesion and wear resistance of the two substrates were analyzed and compared. The results show that the Ni-P coating on the surface of nanocrystalline copper has larger cellular structure and faster deposition rate, and the adhesion and abrasion resistance of the Ni-P coating on the nanocrystalline copper surface are better than that of the Ni-P coating on the surface of coarse crystalline copper.