本文简述了玻璃——金属全气密性高频熔封技术。该技术具有工艺简单、成本低、气密性好、透过率、热稳定性优异等,适合作半导体光电器件光窗帽,也适合于批量生产。 This article describes the glass - metal hermetic high-frequency sealing technology. The technology has the advantages of simple process, low cost, good air tightness, excellent transmittance and excellent thermal stability, and is suitable for a light window cap of a semiconductor optoelectronic device and also suitable for mass production.