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当考虑到印制电路板涂层材料用于熔焊集成电路时,对这种涂层必须通过细致的再三检查。以前所选择的几种材料存在着一些设计和处理上问题,阻碍了这些材料的应用。柯阀丝和铜正在被多涂层或严格控制的单涂层材料所代替。本文讨论了旧材料和新材料的缺点。走线问题有着装配和处理的困难。本研究计划所采用的设计就是用来解决这些问题的一种途径。
When considering the printed circuit board coating materials used in the fusion of integrated circuits, the coating must be carefully checked again. Several materials previously selected have some design and handling issues that hinder the use of these materials. Kevlar wire and copper are being replaced by multi-coated or tightly controlled single-coated materials. This article discusses the shortcomings of old and new materials. Routing problems have the difficulty of assembly and handling. The design used in this research project is one way to solve these problems.