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电镀纯锡在电路板业用于抗蚀已有几十年的历史了,但一般不用于最终表面涂覆,为什么?是否因为锡的晶须问题?晶须究竟能带来多大的危害? 锡是焊剂中的主要成分,而且锡铅共存作为一种可焊性材料已有几个世纪了,锡作为一种可焊性材料能够满足电子领域的需要。它是无毒的,且不会大量渗入地下水,因为在室温下,大部分锡盐是不溶于水的,另外,锡的回收也较为成熟。 我们将重新考虑把锡作为一种电路板成品
Electroplating Pure tin has been used in circuit board industry for decades for corrosion resistance but it is generally not used for the final surface coating. Why? Is it because of the problem of tin whiskers? How much harm whiskers do? Tin Is a major component of flux, and tin-lead coexists as a solderable material for centuries. Tin, as a solderable material, can meet the needs of the electronics field. It is non-toxic and does not infiltrate large quantities of groundwater because at room temperature most of the tin salts are insoluble in water and, in addition, the recovery of tin is relatively mature. We will reconsider using tin as a finished circuit board