引言长期以来电镀工艺是采用直流电,而脉冲电镀是采用方波脉冲电流。脉冲电镀的镀层结晶细致,结合力好,改善了覆盖能力与分散能力,使沉积物分布更均匀,降低沉积物的内应力,改善阳极的溶解作用等。同时镀层的某些物理性质如硬度、耐磨性及抗蚀性能也有改进。我们曾用该项技术制造超小型二极管的凸点银电极,由扫描电子显微镜照片表明, Introduction Electroplating process has long been the use of DC, and pulse plating is the use of square wave pulse current. Pulse plating coating crystal fine, good binding, improved coverage and dispersion capacity, so that the distribution of sediment more evenly, reduce the internal stress of sediments, improve the dissolution of the anode. At the same time some of the physical properties of coatings such as hardness, abrasion resistance and corrosion resistance also improved. We have used this technique to fabricate bump silver electrodes for ultra-small diodes, shown by scanning electron microscopy (SEM)