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目前可以使用的主要互连方法是并行铜线互连和串行铜线或光 纤互连。与串行互连相比,并行互连具有较高的带宽,但有许多问题限制它在高速应用中的普遍应用。尽管可以用差分技术使噪声减少一些,但噪声只是问题之一。高性能铜线互连的体积和重量也令人不便使用,因为千兆比带宽要求厚而单独屏蔽的电缆。但是,主要的限制是时滞。要减少电缆之间的时滞是非常困难的。在25米以上其时滞为4～5ns的带接头的屏蔽电缆价格非常昂贵。
The main interconnect methods currently available are parallel copper interconnects and serial copper or fiber interconnects. Parallel interconnects have a higher bandwidth than serial interconnects, but there are many problems that limit their widespread use in high-speed applications. Although noise can be reduced by differential techniques, noise is only one of the problems. The volume and weight of high-performance copper interconnects are also inconvenient because they require thick, individually shielded cables for bandwidth. However, the main limitation is time lag. It is very difficult to reduce the skew between cables. Shielded cables with joints with a time lag of 4 to 5 ns at 25 meters are very expensive.