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运用空气加压渗流法制备了直径约1.0 mm、孔隙率高达60%的多孔铜样品,并利用多功能内耗仪对材料的阻尼行为进行了研究。结果表明,多孔铜的阻尼能力比致密铜的阻尼能力有了很大提高,同时在内耗-温度谱上发现有两个内耗峰,分别出现在280℃和400℃左右,激活能分别是1.69 eV和2.30 eV。TEM分析发现基体晶界附近存在大量的位错。经分析认为,低温峰起因于位错与晶界交互作用所引起的对晶界粘性滑移限制,高温峰则由晶界弛豫引起。
Porous copper samples with a diameter of about 1.0 mm and a porosity of up to 60% were prepared by pressurized air seepage method. The damping behavior of the material was investigated by a multifunctional internal friction instrument. The results show that the damping capacity of porous copper is much higher than that of compact copper. At the same time, there are two internal friction peaks found in the internal friction - temperature spectrum, which appear at 280 ℃ and 400 ℃ respectively, and the activation energies are 1.69 eV And 2.30 eV. TEM analysis found that there were a large number of dislocations near the grain boundaries. The analysis shows that the low temperature peak results from the dislocation and grain boundary interactions caused by grain boundary viscosity slip restrictions, high temperature peaks caused by grain boundary relaxation.