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TiB2p/Cu composites with high reinforcement content(φp=50%,58%and 65%)for electronic packaging applications were fabricated by squeeze casting technology.The microstructures and thermo-physical properties of the TiB2p/Cu composites were investigated.The results show that TiB2 particles are homogeneous and distribute uniformly,and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the TiB2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20-100℃for TiB2p/Cu composites range from 8.3×10-6to 10.8×10-6/K and decrease with increasing volume fraction of TiB2.The experimental coefficients of thermal expansion agree well with the predicted values based on Turner’s model.The thermal conductivities of TiB2p/Cu composites range from 167.3 to 215.4 W/(m·K),decreasing with increasing volume fraction TiB2.
TiB2p / Cu composites with high reinforcement content (φp = 50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology.The microstructures and thermo-physical properties of the TiB2p / Cu composites were investigated.The results show that TiB2 particles are homogeneous and distribute uniformly, and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB2p / Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20-100 ° C for TiB2p / Cu composites range from 8.3 x 10-6to 10.8 x 10-6 / K and decrease with increasing volume fraction of TiB2. The experimental coefficients of thermal expansion agree with well with the predicted values based on Turner’s model. thermal conductivities of TiB2p / Cu composites range from 167.3 to 215.4 W / (m · K), decreasing with increasing volume fraction TiB2.