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利用镀膜技术制作锰铜传感器,可以实现传感器的超薄化,提高传感器的灵敏度和线性度。改变溅射功率参数,采用中频磁控溅射技术在玻璃(SiO2)衬底上制备出一系列锰铜镍合金薄膜,重点研究沉积条件对薄膜式锰铜传感器薄膜结构、表面形貌等性能的影响。采用三维形貌仪测试薄膜厚度和计算沉积速率;采用原子力显微镜(AFM)研究薄膜的表面特征;采用X射线衍射(XRD)分析了热处理前后薄膜的微观结构;并采用直读光谱仪(DRS)测试溅射靶材和薄膜的成分。研究结果表明:沉积速率随溅射功率增加而增加,溅射功率达到1 kW后沉积速率保持在100 nm·min-1;溅射功率也会明显的影响薄膜的表面形貌,薄膜的表面粗糙度RMS随溅射功率的增加而减小;XRD分析结果表明溅射功率对薄膜的微观结构影响不大,样品的微观结构在热处理前后没有显著变化,只是热处理后样品观察到了微弱的Mn微观结构取向;溅射功率变化对薄膜的成分影响较小,不同功率沉积的薄膜样品的成分相近。
The use of coating technology Manganese copper sensor, sensor can achieve ultra-thin, improve the sensitivity and linearity of the sensor. By changing the sputtering power parameters, a series of Mn-Cu-Ni alloy thin films were prepared on glass (SiO2) substrates by medium frequency magnetron sputtering. The effects of deposition conditions on the film structure, surface morphology and other properties influences. The surface features of the films were investigated by AFM. The microstructures of the films before and after heat treatment were analyzed by X-ray diffraction (XRD). The structures of the films were characterized by direct reading spectroscopy (DRS) Sputtering target and film composition. The results show that the deposition rate increases with the increase of sputtering power, and the deposition rate remains at 100 nm · min-1 after the sputtering power reaches 1 kW. The sputtering power also significantly affects the surface morphology of the film, the surface roughness The RMS of RMS decreases with the increase of sputtering power. The results of XRD show that the sputtering power has little effect on the microstructure of the films, and the microstructure of the samples does not change significantly before and after the heat treatment. The microstructure of the samples is weak after heat treatment Orientation. The change of sputtering power had little effect on the composition of the films, and the compositions of the films deposited by different power were similar.