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本文阐述了化学辅助离子束刻蚀(Chemiclly-assisted ion beam milling)、淀积(后统称离子束修补)技术的基本原理以及实现的过程,同时列举了在集成电路中的几个应用实例。
This paper describes the basic principles and implementation of Chemiclly-assisted ion beam milling and deposition (collectively referred to as ion beam repair) techniques, and lists several application examples in integrated circuits.