一、前言 三维多芯片组件(简称3D-MCM)是在二维多芯片组件(即2D-MCM,通常指的MCM均系二维)技术基础上发展起来的高级多芯片组件技术。二者的区别在于:3D-MCM是通过采用三维(x,y,z方向)结构形式对IC芯片进行立体结构的三维集成技术,而2D-MCM则是在二维(x,y方向)对IC芯片集成,即采用二维结构形式对IC芯片进行高密度组装,是IC芯片的二维集成技术。三维多芯片组 I. Introduction Three-dimensional multi-chip components (referred to as 3D-MCM) are advanced multi-chip component technologies developed based on the technology of two-dimensional multi-chip components (that is, 2D- The difference between the two is that 3D-MCM is a three-dimensional integration technology that uses a three-dimensional (x, y, z) structure to stereoscopically structure an IC chip, while 2D-MCM is a two- IC chip integration, that is, the use of two-dimensional structure of high-density IC chip assembly, IC chip is the two-dimensional integration technology. Three-dimensional multi-chip group