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采用全新的玻璃隔离架梁技术,成功地研制出无封装、低势垒、环形梁式引线混频四管堆(见左图)。这种玻璃隔离技术解决了硅MMIC及硅单元模块研制中有源器件之间隔离的困难,并有较高可靠性,可不经封装直接用于微波电路,工作频率可达2cm波段。在隔离介质的光刻腐蚀中采用了复合光刻技术,解决了玻璃隔离与硅低势垒制作工艺相容性问题。并采用了选择电镀、红外光刻等技术。 四管堆单管电性能均匀,1mA下正向压降250mV,势垒优值1.07,电容0.2pF,串联电阻9n左右。
With the new glass-isolating girder technology, the uncoated, low-barrier, toroidal beam-mixing four-tube stack has been successfully developed (see photo to the left). This glass isolation technology solves the problem of isolation between active devices in the development of silicon MMICs and silicon cell modules with high reliability that can be used directly in microwave circuits without packaging and operates at frequencies up to 2 cm band. The use of composite lithography in photolithographic etching of isolated media solves the problem of compatibility between glass isolation and silicon low barrier fabrication processes. And adopted the choice of electroplating, infrared lithography and other technologies. Single tube of four-tube reactor performance uniform, forward voltage drop 1mA 250mV, barrier superior value 1.07, capacitance 0.2pF, series resistance 9n or so.