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采用模压成型和真空压力浸渗工艺制备了高体积分数SiC增强Al基复合材料(AlSiC)。物相和显微结构研究结果表明,此种方法制备的AlSiC复合材料,组织致密且大小两种粒径的SiC颗粒均匀分布于Al基质中,界面结合强度高;SiC增强颗粒与Al基质界面反应控制良好,未出现Al4C3脆性相。对Al4C3相形成机理进行了分析,指出6061铝合金中的Si元素和真空压力浸渗工艺条件有利于防止脆性相Al4C3的形成。热性能测试结果表明,随温度升高,复合材料热膨胀系数先增大后减小,315℃附近出现最大值。所获得复合材料的平均热膨胀系数为7.00×10-6℃-1,热导率为155.1W/mK,密度为3.1g/cm3,完全满足高性能电子封装材料的要求。
High volume fraction SiC reinforced Al matrix composites (AlSiC) were prepared by compression molding and vacuum pressure impregnation. The results of phase and microstructure studies show that AlSiC composites prepared by this method have uniform microstructure and size distribution of SiC particles uniformly distributed in the Al matrix with high interfacial bonding strength. The interfacial reaction between SiC particles and Al matrix Well-controlled, no brittle Al4C3 phase appears. The forming mechanism of Al4C3 phase was analyzed. It was pointed out that Si element and vacuum pressure infiltration conditions in 6061 aluminum alloy were favorable to prevent the formation of brittle phase Al4C3. The results of thermal performance test show that with the increase of temperature, the thermal expansion coefficient of the composite first increases and then decreases, and the maximum value appears near 315 ℃. The average thermal expansion coefficient of the obtained composite material is 7.00 × 10-6 ℃ -1, the thermal conductivity is 155.1W / mK and the density is 3.1g / cm3, which fully meets the requirements of high performance electronic packaging materials.