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本文提出测量半导体致冷材料热传导率k的一种简便而实用的方法。利用G_e晶体管芯在吸收电功率P_c后,转换为热量Q.使结温上升。因此可把G_e管芯作为测试用的热源,同时,利用管芯的V_(BE)——T特性在较宽的温度范围内近似线性的特点,可以较方便、准确地测出热源的温度,进而得出材料的热传导率。这种测试方法所需装置较简单,操作较方便,重复性较好,具有一定的测量精度,适宜研制或生产材料过程的常规测量。
This paper presents a simple and practical method to measure the thermal conductivity k of semiconductor refrigeration materials. The G_e transistor core absorbs the electric power P_c and is converted into the heat Q. The junction temperature is increased. Therefore, the G_e die can be used as the heat source for the test. At the same time, the V_ (BE) - T characteristic of the die can be used to measure the temperature of the heat source more conveniently and accurately because of the nearly linear characteristic of the die in the wide temperature range, And then come to the thermal conductivity of the material. This test method requires a simple device, the operation is more convenient, better repeatability, with a certain degree of measurement accuracy, suitable for the development or production of materials routine measurement.