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ＮＥＣ开发了电气检查微细间距电极结构的ＭＣＭ (ＭｕｌｔｉＣｈｉｐＭｏｄｕｌｅ :多芯片组装 )、ＣＳＰ (ＣｈｉｐＳｉｚｅＰａｃｋａｇｅ :芯片规模封装 )的基板和搭载器件连结部位的台式高速探针。本探针是在Ｘ Ｙ Ｚ方向搭载两只可动高精度自动探针 ,在Ｚ轴采用具备高速
NEC has developed MCM (MultiChipModule), CSP (Chip Scale Package) substrates and bench-mounted high-speed probes for the connection of devices with a fine pitch electrode structure. This probe is equipped with two movable high-precision automatic probes in the X Y Z direction and a high-speed