晶片连接:普通的硅——金易熔焊接是连接半导体晶片和混合电路的最普通的方法。这种易熔温度为370℃,而焊接过程是在400℃或更高的温度下进行的。24K 金经过屏蔽并直接地熔化在陶瓷或普通的金属陶瓷上。当碱性硅或金衬底(goldback)硅模与24K 金紧密接触时,则此模就会熔化从而产生焊接(在规定的压力和温度范围内)。如欲把很多小片都焊在衬底上时,就要采用“热气”技术,因此,热量传到被焊 Wafer connections: Common silicon-gold fusible solders are the most common method of connecting semiconductor wafers and hybrid circuits. The fusible temperature is 370 ° C, and the welding is done at 400 ° C or higher. 24K gold is shielded and melted directly on ceramic or normal cermet. When a basic silicon or goldback silicon mold is in intimate contact with 24K gold, the mold will melt to create the weld (within the specified pressure and temperature range). If you want a lot of small pieces are welded on the substrate, it is necessary to use “hot gas” technology, so the heat spread to be welded