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研究了在钢和Ａｌ中脉冲注入Ｔｉ和Ｍｏ的条件下金属间化合物形成的规律及生长机理，给出了金属间化合物生长与靶温的关系，得出的实验结果与计算相符合。与电镜中退火原位观察结果比较发现，注入过程中金属间化合物生长温度（４００℃）比退火中金属间化合物生长温度（６００℃）低得多，说明注人过程中空位流和间隙原子流能促进金属间化合物的生长。通过脉冲注入已得到十余种金属化合物和金属间化合物，这些化合物的出现提高了注入层的硬度，改善了抗磨损特性。
The formation mechanism and growth mechanism of intermetallic compounds under pulsed Ti and Mo implantation into steel and Al were studied. The relationship between the growth of intermetallic compounds and the target temperature was given. The experimental results were in good agreement with the calculated results. Compared with the results of in-situ annealing in electron microscope, it was found that the intermetallic compound growth temperature (400 ℃) was much lower than the intermetallic compound growth temperature (600 ℃) during the injection process, indicating that the vacancy flow and interstitial atom flow Can promote the growth of intermetallic compounds. By pulse injection, more than ten kinds of metal compounds and intermetallic compounds have been obtained. The presence of these compounds improves the hardness of the implanted layer and improves the anti-wear properties.