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在温度为１２７３ ～１４２３ Ｋ、时间为０ ．９ ～７ ．２ ｋｓ 和０ ．１ ＭＰａ 压应力的条件下进行了Ｓｉ３Ｎ４／Ｔｉ／Ｎｉ／Ｔｉ／Ｓｉ３Ｎ４ 的部分瞬间液相连接， 结合ＳＥＭ， ＥＤＳ 和ＸＲＤ 测试结果， 分析了连接温度和时间对接头常温四点弯曲强度和断裂方式的影响。通过用反应层厚度来表征界面强度， 用σＲｅｓθｍａｘ 来评价近界面陶瓷断裂， 用σＲｅｓθ＝ ０ 来评价界面断裂， 建立了界面强度、陶瓷强度和残余应力与接头强度和三种断裂类型的关系模型。
At a temperature of 1273 ~ 1423 K, time is zero. 9 ~ 7. 2 ks and 0. The transient liquid phase connection of Si3N4 / Ti / Ni / Ti / Si3N4 under 1 MPa compressive stress was investigated. The results of SEM, EDS and XRD showed that the connection temperature and time had no effect on the four-point bending strength and fracture mode Impact. The interfacial fracture was evaluated by σResθmax, and the interfacial fracture was evaluated by σResθ = 0. The relationship model between interfacial strength, ceramic strength and residual stress, joint strength and three fracture types was established.