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以纯铜为研究对象,通过添加镍粉进行表面机械研磨(SMAT)处理。用光学显微镜(OM)、X射线衍射分析仪(XRD)和扫描电镜(SEM)对SMAT处理后样品的组织及成分变化进行分析。采用X射线能量色散谱分析方法(EDS)分析Ni元素在合金层中的分布与含量。结果表明,纯铜表面出现了明显的分层现象,同时铜镍发生互扩散有铜镍合金形成。处理120 min后形成厚度为35μm铜镍合金层,而240 min厚度则达到55μm,并且合金层与基体变形层结合紧密。由于弹丸的冲击产生应力应变和大量储存能,使得原子的跳动频率增加同时降低了扩散激活能,实现铜镍在较低温度下快速互扩散。
Pure copper as the research object, by adding nickel powder surface mechanical grinding (SMAT) treatment. The microstructure and composition of SMAT-treated samples were analyzed by optical microscope (OM), X-ray diffraction (XRD) and scanning electron microscopy (SEM). The distribution and content of Ni element in the alloy layer were analyzed by energy dispersive X-ray spectrometry (EDS). The results show that there is obvious delamination on the surface of pure copper, and the copper-nickel interdiffusion is formed by copper-nickel alloy. After 120 min of treatment, a Cu-Ni alloy layer with a thickness of 35 μm was formed, and the thickness of the Cu-Ni alloy layer reached 55 μm after 240 min, and the alloy layer and the deformed layer of the substrate were tightly bonded. Due to the impact of projectile stress and strain and a large number of stored energy, making the atomic bouncing frequency increases while reducing the diffusion activation energy to achieve rapid copper-nickel diffusion at lower temperatures interdiffusion.