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Magnetic-particle-composite-medium-filled stacked-spiral inductors for rf complementary metal oxide semiconductor (CMOS) applications in GHz are demonstrated.The new inductor features a nearly closed magnetic circuit loop,an optimized high-permeability and low-loss sub-1 μm magnetic particles composite core,and a developed 0.18-μm CMOS-compatible device fabrication process.An equivalent circuit model with structural amplifying factors is proposed and modeled.The prototype of the 6-level stacked inductor with Co2Z magneticparticles-composite-medium filling increases the inductance L by 50%,and quality factor Q by 37% at frequencies as high as 1 GHz,with high inductance density as 825 nH/mm2 and a reduced size area by 80% compared to the planar spiral inductor.