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Rapidly solidified Sn?9Zn?0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd (mass fraction) addition on the microstructure, thermodynamic characteristic of Sn?9Zn solder alloy were analyzed. The tensile?shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn?9Zn?0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn?Zn?RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn?9Zn?0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn?9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.