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对于大型结构隔振效果的检测,目前已形成了以频响方法为基础的结构动力分析技术。但对于小型仪器仪表那样的结构,由于传感元件小型化的限制,其隔振效果的检测,还没有理想的测试手段。本文根据激光全息测振原理,对小型集成电路板在不同持承条件下的隔振效果作了全息测定;还用不同隔振材料,在不同激振频率下,对模拟结构的隔振效果作了测定。实验表明上法对非接触,全场检测隔振效果是可行的。本文还给出了计算位移场的递推公式,并对实验结果作了定量和定性的分析。
For the detection of vibration isolation effect of large-scale structures, the structural dynamic analysis technology based on the frequency response method has been formed. However, for the structure of a small instrumentation, due to the miniaturization of the sensing element, there is no ideal test method for detecting the vibration isolation effect. In this paper, based on the principle of laser holographic vibration measurement, the holographic determination of the isolation effect of small integrated circuit boards under different holding conditions is made. The vibration isolation effect of the simulation structure is also made with different vibration isolation materials under different exciting frequencies The determination. Experiments show that the method of non-contact, the whole test vibration isolation is feasible. In this paper, the recursion formula for calculating the displacement field is also given, and the experimental results are quantitatively and qualitatively analyzed.