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目前电子工业中的腐蚀与防护问题日益受到重视,日本腐蚀与防护协会为掌握电子元件腐蚀问题的现状,于1985年11月举行的第63次腐蚀与防护讨论会,以电子零件方面的腐蚀等问题为主题进行了专题讨论,塑料封装电子材料方面的腐蚀问题也是其中的一个专题。在彩电流水线上环氧封装材料用量很大,但我国仍需进口,且价格昂贵,国产封装材料与国外同类产品相比,在机械性能和树脂与填料的浸润化方面尚存在差距,本文主要通过国外同类样品的分析,立足于国内原料,研究配方工艺,以期提高环氧封装材料的性能。
At present, the corrosion and protection issues in the electronics industry are gaining more and more attention. The Japan Society for Corrosion and Protection, in order to grasp the status quo of the corrosion of electronic components, the 63rd Corrosion and Protection Symposium held in November 1985, the corrosion of electronic components, etc. Thematic issues were the subject of discussion, and the issue of corrosion of plastic encapsulated electronic materials was also one of them. In the color TV water line epoxy packaging materials, a large amount of use, but China still needs to import, and expensive, domestic packaging materials compared with similar foreign products, there is a gap in the mechanical properties and resin and filler infiltration, this paper mainly through Analysis of similar foreign samples, based on domestic raw materials, research formula technology, in order to improve the performance of epoxy packaging materials.