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高速I/O(HSIO)和串行链路数据速率一直在增长,平均每两到三年就会翻倍,以满足网络和计算机系统越来越高的带宽需求。除了带宽增长,速度不断提高也促使器件或电路板的密度和吞吐量不断提高,因而迫切需要准确而先进的仿真和建模方法。一些新出现的需求都非常具有挑战,例如,能够对深亚微米或者更小的工艺节点、电压和温度(PVT)变化进行建模,全面掌握链路的所有关键模块以及填补建模和测量之间的空白等。
Data rates for high-speed I / O (HSIO) and serial links have been on the rise, doubling on average every two to three years to meet the ever-increasing bandwidth demands of networks and computer systems. In addition to bandwidth growth and increasing speed, which leads to ever increasing density and throughput of devices or boards, there is an urgent need for accurate and advanced simulation and modeling methods. Some of the emerging requirements are very challenging, such as the ability to model deep sub-micron or smaller process nodes, voltage and temperature (PVT) changes, a complete grasp of all the key modules of the link, and the ability to fill the modeling and measurement Between the blank.