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采用溶胶-凝胶法,在盐酸的催化下合成SiO_2微球,并以此SiO_2微球改性TDE-85环氧树脂,制备SiO_2/环氧树脂材料。通过傅里叶变换红外光谱(FTIR)、扫描电镜(SEM)和激光粒度仪表征SiO_2微球的结构、形貌和粒径,采用动态力学分析仪(DMTA)研究环氧树脂固化物的热稳定性。结果表明,SiO_2微球的粒径分布均匀,SiO_2/环氧树脂材料的玻璃化转变温度(Tg)为189.8℃,比纯环氧树脂提高了5.2℃。
The sol-gel method was used to synthesize SiO 2 microspheres under the catalysis of hydrochloric acid, and the TDE-85 epoxy resin was modified by SiO 2 microspheres to prepare SiO 2 / epoxy resin. The structure, morphology and particle size of SiO 2 microspheres were characterized by Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM) and laser particle sizer. The thermal stability of the epoxy resin was studied by dynamic mechanical analyzer (DMTA) Sex. The results showed that the size distribution of SiO 2 microspheres was uniform. The glass transition temperature (Tg) of SiO 2 / epoxy resin was 189.8 ℃, which was 5.2 ℃ higher than pure epoxy resin.