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一、超大规模集成电路与对洁净室的要求 1、有害的尘埃粒子直径与洁净度在半导体制造过程中,有害的尘埃粒子直径一般认为是精密加工尺寸的1/5～1/10。现将其与对象产品一同示于图1。在超大规模集成电路为256千位或1兆位产品的时代,为了谋求提高产品的成品率、质量和可靠性,由图可知有必要以0.1微米代替过去以0.5微米尘埃粒子直径为对象进行洁净度的
1. Ultra-large-scale integrated circuits and requirements for clean rooms 1. Dangerous dust particle diameter and cleanliness In the semiconductor manufacturing process, the diameter of harmful dust particles is generally considered to be 1/5 to 1/10 of the precision processing size. It is shown together with the target product in Figure 1. In the era of ultra-large-scale integrated circuits with 256 kilobits or 1 megabits of products, in order to improve product yield, quality, and reliability, it is clear from the figure that 0.1 micron is necessary instead of using the 0.5 micron dust particle diameter as the object of cleanliness. Degree