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对模拟电子系统中热现象的计算机分析工具的兴趣和呼声日益增加，这种多学科并行工程需要分析工具完全集成到参量化的机械设计软件中去。新一代系统兼收并蓄热网络模型直观的特点和计算流体力学技术模拟三维流体流动的强势。比较了几个算例的热测试实验值和该系统的计算值，每一个算例都取得了良好一致。
The interest and voices of computer analysis tools for simulating thermal phenomena in electronic systems are increasing, and this multidisciplinary, parallel project requires that the analysis tools be fully integrated into the parametric mechanical design software. Intuitive features of a new generation system of combined heat and regenerative network models and computational fluid dynamics simulate the strength of three-dimensional fluid flow. A few examples of the thermal test experimental values and the calculated value of the system, each case has made good agreement.