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根据两次曝光法检测加载前后焊点的应变情况 ,提出一种高性能的钎焊质量检测方法 ,提高电子产品的可靠性和稳定性。
According to the double exposure method to detect the strain of the solder joint before and after loading, a high-performance brazing quality testing method is proposed to improve the reliability and stability of the electronic product.