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以1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZ-DA)为固化剂,采用示差扫描量热法(DSC),TGA,红外光谱及剪切强度测试研究了双酚F环氧树脂/DHPZ-DA粘接体系固化行为及耐热性。由Kissinger和Ozawa方法计算得到固化体系的表观活化能分别为80.1 kJ/mol和84.3kJ/mol。由Crane方程求得的表观反应级数为0.93。该胶粘剂体系Tg>200℃,当双酚F环氧树脂与DHPZ-DA固化剂的物质的量比为10∶4时,其室温剪切强度与150℃老化24 h后的剪切强度均大于12 MPa,表现出良好的耐热性。
(DHPZ-DA) was obtained from 1,2-dihydro-2- (4-aminophenyl) -4- [4- Curing agent, the curing behavior and heat resistance of the bisphenol F epoxy resin / DHPZ-DA adhesive system were studied by differential scanning calorimetry (DSC), TGA, infrared spectroscopy and shear testing. The apparent activation energies of the cured system calculated by Kissinger and Ozawa methods are 80.1 kJ / mol and 84.3 kJ / mol, respectively. The apparent reaction order obtained by the Crane equation was 0.93. The adhesive system Tg> 200 ℃, when the ratio of bisphenol F epoxy resin to DHPZ-DA curing agent is 10: 4, the shear strength at room temperature and after aging at 150 ℃ for 24 h are both greater than 12 MPa, showing good heat resistance.