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本文介绍了应用UG NX10.0热分析优化设计的实例。利用UG NX10.0,仿真分析了一种印制板电路的温度在不同结构形式下的变化。实例通过UG NX10.0仿真分析,提供在优化设计中的一些借鉴意义。
This article describes the application of UG NX10.0 Thermal Analysis Optimization Design examples. Using UG NX10.0, simulation analysis of a printed circuit board temperature changes in different forms of structure. Examples by UG NX10.0 simulation analysis, to provide some reference in the optimization design.