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运用电化学循环伏安和石英晶体微天平(EQCM)方法研究了酸性介质中铜阳极溶出和阴极沉积过程.结果表明:铜阳极溶出和阴极沉积过程都只有一个电流峰,其M/n分别为32.0和34.2g/mol,且都是一个2-电子过程.在目前实验条件下,并未检测到Cu(I)中间产物,这与极谱研究酸性硫酸盐溶液中Cu2+只有一个极谱波相一致.本文从电极表面质量定量变化的角度提供了Cu阳极溶出和阴极沉积过程的新数据.
Electrochemical cyclic voltammetry and quartz crystal microbalance (EQCM) were used to study the copper anode dissolution and cathodic deposition process in acidic media. The results show that there is only one current peak in copper anodic dissolution and cathodic deposition, and the M / n is 32.0 and 34.2 g / mol, respectively, and they are both 2-electron processes.Under the current experimental conditions, Cu (I) intermediate was not detected, which is consistent with the fact that there is only one polarographic phase of Cu2 + in acid sulfate solution The new data for Cu anodic dissolution and cathodic deposition processes are provided in this paper from the perspective of quantitative changes in surface quality of the electrode.