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高可靠性集成电路通常需要在较高温度下进行电测试。电测试期间控制该电子器件温度的通用方法是将被测件(DUT)置于高速、热调节的空气流中。空气流温度极限和变化率以及流率将控制器件温度。
High reliability integrated circuits often require electrical testing at higher temperatures. A common method of controlling the temperature of an electronic device during electrical testing is to place the device under test (DUT) in a high-speed, thermally conditioned air stream. Airflow temperature limits and rate of change and flow rate will control the device temperature.