论文部分内容阅读
光敏聚酰亚胺广泛用于微电子领域的绝缘层和保护层。采用非光敏聚酰亚胺时光刻工艺相当复杂，而使用光敏聚酰亚胺时图形加工工艺得到简化，因而引起人们的极大兴趣。本文综述了这类高分子材料的研究现状，并阐明了笔者的一些看法。
Photosensitive polyimide is widely used in the field of microelectronics insulating layer and protective layer. The photolithographic process is quite complicated when using a non-photosensitive polyimide, and the process of patterning is simplified when the photosensitive polyimide is used, which is attracting great interest. This article summarizes the research status of this type of polymer materials and clarifies some of the author’s views.