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对楔形腔光场传输模式进行对比分析,改变MEMS工艺参数,加工出楔角外侧下边缘带有“齿”的10°楔角楔形腔;设计光纤架与壳体,采用力学咬合的方式,对锥形光纤耦合位置进行固定,实现力学无胶封装,消除了封装材料性能退化对倏逝场产生的破坏,获得了稳定的倏逝场耦合模式,进而得到稳定的高品质因数(Q);封装前后楔形腔倏逝场耦合模式改变微小,Q值不随时间产生退化。使用高速转台对封装结构进行稳定性测试,5g离心转动前后,楔形腔与锥形光纤耦合位置不变。
The transmission mode of wedge cavity was compared and the MEMS process parameters were changed. The 10 ° wedge angle wedge cavity with “Tooth” was machined out from the lower edge of wedge angle. The optical fiber frame and the shell were designed by means of mechanical bite , The coupling position of the tapered optical fiber is fixed so as to realize the mechanical glueless encapsulation and eliminate the damage to the evanescent field caused by the degeneracy of the encapsulating material and obtain the stable evanescent coupling mode so as to obtain a stable high quality factor (Q) The coupling mode of the evanescent field in the wedge cavity before and after the encapsulation changed little and the Q value did not degrade with time. The use of high-speed turntable package structure for stability testing, 5g before and after centrifugation rotation, the tapered cavity and taper fiber coupling position unchanged.