论文部分内容阅读
采用Sn-2.5Ag-2.0Ni焊料钎焊两种化学镀Ni(P)后的SiCp/Al复合材料。由于P含量的不同,SnAgNi焊料与Ni(P)镀层之间生成了两种不同的微观结构。SnAgNi/Ni(5%P)接头中致密的Ni3Sn4金属间化合物(IMC)层导致了较低的Ni扩散速度和Ni3Sn4生长速度。而SnAgNi/Ni(10%P)焊料接头中疏松的Ni3Sn4化合物使Ni具有较高的扩散速度,从而导致较高的Ni3Sn4生长速度,这也影响了接头的剪切强度。前者的断裂主要是由Ni3Sn4化合物的生长和微裂纹的生成造成的,而后者主要是Ni向焊料中扩散使得基体和镀层之间形成了孔洞,从而导致SiCp/Al复合材料与Ni(P)镀层结合力的迅速降低。
Two kinds of SiCp / Al composites after electroless Ni (P) plating were brazed with Sn-2.5Ag-2.0Ni solder. Due to the different P content, two different microstructures were formed between SnAgNi solder and Ni (P) coatings. The dense Ni3Sn4 intermetallic compound (IMC) layer in SnAgNi / Ni (5% P) joints results in lower Ni diffusion rate and Ni3Sn4 growth rate. The loose Ni3Sn4 compounds in SnAgNi / Ni (10% P) solder joints resulted in a higher diffusion rate of Ni, resulting in higher Ni3Sn4 growth rate, which also affected the shear strength of the joints. The former is mainly caused by the growth of Ni3Sn4 compounds and the formation of microcracks. The latter is mainly due to the diffusion of Ni into the solder, resulting in the formation of voids between the substrate and the coating, resulting in the formation of SiCp / Al composite with Ni (P) The combination of rapid reduction.