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五,SMT的焊接工艺分析表面安装的焊接大致分为两种类型。第一种以波峰焊为代表的焊接方式。这种方法是使用粘胶剂把表面安装元件粘合在印刷电路板平面上,然后通过波峰焊进行焊接,一般称谓粘结/波峰焊,目前把SMD与插入元件相对安装在一个平面上亦可以用波峰焊一次完成,称为混合组装。第二种为重熔再流焊,这种工艺是把焊膏敷于基板平面的导电互连点上,然后将表面安装元件放在焊膏上,大约在85℃的温度下凝固,最后通过回熔焊接机一次焊成,一般称谓焊膏/再流焊。 1.粘接/波峰焊用于表面安装的波峰焊接机,应使用喷射式波
Fifth, SMT welding process analysis Surface-mounted welding can be divided into two types. The first wave soldering as the representative of the welding method. This method is the use of adhesive surface mount components bonded to the printed circuit board plane, and then through the wave soldering, generally referred to as bonding / wave soldering, the SMD and the relative insertion of the current components installed in a plane can also be Wave soldering done once, known as the hybrid assembly. The second is reflow reflow, a process that applies solder paste to conductive interconnects on the substrate plane, places the surface mount components on solder paste, solidifies at about 85 ° C, and finally passes Back to the welding machine once welded into, the general name of solder paste / reflow. 1. Bonding / Wave Soldering Wave soldering machines for surface mounting should use jet-type waves