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在1950年前后,大多数电子,通讯设备中的电接触元件,均在相当高的电压和接触力下工作,此时,即使在电接触表面形成使接触电阻升高的变色膜,也不难借电的或机械的方式击穿。随着微电子器件的发展,大大缩小了设备的体积,从而对小型化的、多接点的、分离式的电接触元件(连接器)的需求增加了,而这类元件的接触力通过的电流、电压均非常小。为了满足其精密的电性
Before and after 1950, the electrical contact elements in most electronic and communication devices were operated under relatively high voltage and contact force. In this case, it is not difficult to form a color changing film with higher contact resistance on the electrical contact surface Breakdown by electric or mechanical means. With the development of microelectronic devices, the size of the device is greatly reduced, thereby increasing the demand for miniaturized, multi-contact, discrete electrical contact elements (connectors), and the contact current of such elements , The voltage is very small. In order to meet its sophisticated electrical properties