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这是首次在日本举行国际电加工会议,是由日本电加工工程师协会主办。为使会议在飞速发展的技术革命中起到巨大的作用,会议组织委员会安排的本次ISEM会议与以往会议有所不同。讨论题目的范围将有所扩大,并对先进加工技术的复合予以特殊关注。以下是计划的大概介绍。论题:1.一般论题:先进加工技术,包括:放电加工、电化学加工、激光束加工、干浸蚀加工(Dry Etching)、超精切割、微细加工等,以及它们对零件、工具、模具等
This is the first time the International Electroplating Conference is held in Japan and is hosted by Japan Electro-Mechanical Engineers Association. In order for the conference to play a huge role in the rapidly developing technological revolution, the ISEM meeting scheduled by the conference organizing committee is different from previous meetings. The scope of the discussion topics will be expanded with special attention paid to the compounding of advanced processing techniques. The following is an introduction to the plan. Topics: 1. General Topics: Advanced Processing Technologies, including: EDM, Electrochemical Processing, Laser Beam Processing, Dry Etching, Super Fine Cutting, Micromachining etc., and their use in parts, tools, molds, etc.